product details

Application Area

Measurement of diffraction performance of chips in semiconductor field

Features and Advantages

High precision visual positioning to ensure the accuracy of chip inspection position

Adjustable imaging systems - Compatible with different types of chip detection

Self developed software algorithm with complete functions to meet different customer needs

Technical Parameters

Repetitive positioning accuracy 3um

UPH:2500-3500

Compatible with two different types of products: DOE and Diffuseri

Repeated detection data fluctuates within 5%

Maximum FOV of products supported for detection: 110

The high-precision positioning vision system calibrates the angle and position of the wafer to ensure that each chip on the wafr can be exactly above the light source during the detection process;

The height of light source in Z direction can be adjusted by motor to meet the distance requirements of different lasers or modules.